Our R&D Expertise

Explore the technology areas where Singapore has built deep capability, from early-stage research through to platforms ready for industry.

Advanced Packaging

Advanced packaging brings different chips, memory, photonics and specialised components closer together in compact, high-performance systems. As performance gains increasingly depend on system-level integration, packaging is becoming critical to achieving higher bandwidth, lower latency, better power efficiency and new form factors beyond transistor scaling alone.

Built on more than a decade of national investment
Since 2011, Singapore has developed capabilities spanning fan-out wafer-level packaging (FOWLP), 2.5D interposer technology, 3D integration, hybrid bonding and optical engine packaging. For companies developing next-generation semiconductor systems, this provides a foundation to explore, prototype and validate new integration approaches across high-density interconnects, chiplets, electronic-photonic integration and system-level packaging.

Relevant application areas include:

AI, high-performance computing and data centres
Co-packaged optics and next-generation connectivity
3D memory and high-density chiplet integration
RF front-end modules, antenna-in-package and 5G/6G
Automotive radar and advanced electronics

A*STAR IME anchors advanced packaging
platforms and a 300mm pilot-line where technologies can be developed and validated using industry-grade tools. This is supported by wafer-level processes, interconnect technologies, PDKs, system-technology co-optimisation and modelling.

This is complemented by NUS SHINE’s research-to-application capabilities in hybrid integration, a key area underpinning advanced packaging. SHINE’s work spans additive patterning, printing, bonding, materials handling, and device and circuit co-design, supported by its Heterogeneous Packaging and Test Lab within NUS’ E6NanoFab.

Singapore offers advanced packaging platforms that help companies move complex integration concepts closer to validated technologies. These platforms provide a foundation to explore, prototype and validate new approaches in areas such as chiplets, high-density interconnects and electronic-photonic integration.

FOWLP	Redistribution layer line/space: < 1 µm Number of redistribution layers: > 5 Micro-bump pitch: < 20 µm Through-mold interconnect pitch: ≤ 100 µm
2.5D Interposer	TSV dimension: 1 × 15 µm Reticle size: > 3× large 2.5D interposer I/Os per package: > 10⁵ Thermal solution and power delivery: > 1 kW
3D Integration	Wafer-to-wafer hybrid bonding pitch: 0.4 µm Chip-to-wafer hybrid bonding pitch: 2.5 µm Wafer-to-wafer / chip-to-wafer hybrid bonding stack: > 4 stack Chip-to-wafer TCB micro-bump stack: > 12 stack
Optical Engine Packaging	Demonstrated package: 800G/1.6T, 100G/200G × 8 channels High-speed interconnect design supporting package performance up to 120 GHz FOWLP platform for compact integration of electronic and photonic integrated circuits

As semiconductor systems bring together more diverse chips, materials and functions, Singapore is exploring new ways to co-design devices, circuits, processes and form factors for future advanced packaging needs. These efforts help build the foundation for more compact, reliable and high-performance systems, while identifying approaches that can be matured towards industry-relevant development.

Research Area	What it explores	Why it matters?
Device, Circuit and Form Factor Co-Design	Microelectronic device and circuit design for reliable hybrid component integration across nanometer-to-micrometer scales, with attention to thermal, energy and signal management	Enables advanced packages to be designed as integrated systems, where device performance, circuit behaviour, heat, power, signal integrity and form factor are considered together
Hybrid Process Integration Capabilities	New process equipment capabilities, additive patterning, printing, bonding, throughput enhancement, material handling, hybrid processing and packaging	Supports the development of integration processes needed to bring different components, materials and devices together in compact, high-performance systems

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Silicon Photonics

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MEMS (Micro-Electro-Mechanical Systems)

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Our R&D Expertise

Explore the technology areas where Singapore has built deep capability, from early-stage research through to platforms ready for industry.

Advanced Packaging

Silicon Photonics

MEMS (Micro-Electro-Mechanical Systems)

Flat Optics

Power Electronics

RF GaN

RF & Cryogenic Integrated Circuit Design